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A/D数模混合电路板设计

来源:龙人计算机研究所 作者:站长 时间:2006-11-25 09:28:53

Design Capabilities

  • Highest layer count :28
  • High speed large digital boards
  • High density digital boards
  • Backplane
  • Probe card
  • Chip on board
  • Motherboard
  • High-end computing
  • IPC(Industrial Personnal Computer) board
  • Telecommunication boards
  • Blind,Buried vias, Microvias and Via-in-Pad boards
  • Minimum BGA pin-pith: 0.5mm
  • Highest signal speed : 10 GHz differential signal
  • Minimum line width :3MIL
  • Minimum via hole size :8mil (4mil Laser drill)

Important Chips

  • Intel2850、intel2800、intel 2400、intel 1200
  • 英特尔服务器平台Bensley,以及Dempesy和Woodcrest两大系列双核处理器
  • 基于Intel 5000V芯片组的GA-7VCSV和基于Intel 5000P芯片组的GA-7BESH
  • INTEL芯片组:810 815 845 865 915 945
  • Motorola的PowerPC系列:MPC8260、MPC850、MPC750、MPC8272、MPC8247、MPC8245、MPC860、 MPC8241、MPC8240
  • Motorola的ColdFire MCF5XXX系列(如MCF5206E)
  • RMI RevA,RevB, RevC and RevD---Demo board designed by HAMPPCB
  • IDT的Interprise? PCI系列(如:79RC32332)
  • galileo: GT-48304、GT-48350、GT-48520等
  • Broadcom 1255 1250 1125 5464、5691、5670、5690、5421
  • Xilinx: Virtex II,Virtex Pro
  • TI: C6415 C5561 DM642 TMS320DMXXX, DaVinci C6446芯片 等系列DSP处理器
  • Marvell:98DX241、88E1145、98FX9110、98EX125
  • pericom: PI7C7300等
  • national: dp83815等
  • Cicada Semiconductor:Cis8224、Cis8204、Cis8201
  • VITESSE:VSC7303
  • AMCC Chips

Design Expertise

  • DDR/DDRII 800M/QDR/SRAM memory interface
  • Switch Power Supply
  • PCI, CPCI, PCI-X, PCIE, SATA, SATA II, XAUI
  • ATCA, AMC, HyperTransport
  • TI DLP-RAMBUS RDRAM
DFX Consideratios
  • DFM: Design For Manufacture
  • DFA: Design For Assembly
  • DFT:Design For Test
  • DFR:Design For Reliability
  • DFC:DESIGN FOR COST